寒武纪科技
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27

2016-10

PCB Engineer

PCB Engineer Location: Beijing/Shanghai Responsibilities: -Design board design according to customer requirements -PCB layout, Place&Route and testing -PCB production, test and debug

27

2016-10

FPGA R&D Engineer

FPGA R&D Engineer Location: Beijing/Shanghai Responsibilities: -Realize, simulate, test intelligent chip design on FPGA -Timing/resources optimization in FPGA -Contribute to chip finishing in collaboration with software/hardware engineers

27

2016-10

Android Driver R&D Engineer

Android Driver R&D Engineer Location: Beijing/Shanghai Responsibilities: -Design, develop, optimize, testing, maintain of Android driver for intelligent chips

27

2016-10

Linux Driver R&D Engineer

Linux Driver R&D Engineer Location: Beijing/Shanghai Responsibilities: -Design, develop, optimize, testing, maintain of Linux driver for intelligent chips

27

2016-10

SDK R&D Engineer

SDK R&D Engineer Location: Beijing/Shanghai Responsibilities: -Design, develop, optimize, testing, maintain of Linux/Android SDK library for intelligent chips

27

2016-10

Algorithm R&D

Location: Beijing/Shanghai Responsibilities: -Design, develop advanced artificial algorithms with deep learning, machine learning etc. -Contribute to chip design in collaboration with digital design engineers

27

2016-10

Digital Design Engineer

Digital Design Engineer Location: Beijing/Shanghai Opportunities: Graduate/Undergraduate, Full-time/Internship Responsibilities: -Handle the implementation frontend part and RTL design and debug.

27

2016-10

Senior Physical Design Engineer

Senior Physical Design Engineer Location: Beijing/Shanghai Responsibilities: -Handle the tapeout of design, including floorplanning, place&route, timing and physical signoff -Maintain and improve the design flow of tapeout

27

2016-10

Physical Design Engineer

Physical Design Engineer Location: Beijing/Shanghai Responsibilities: -Handle the tapeout of design, including floorplanning, place&route, timing and physical signoff
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