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Dr. Tianshi Chen, the founder and president of Cambricon Technologies, is an international distinguished young scientist in the field of processor architecture and artificial intelligence. He received the Ph.D. degree from Dept. of Computer, University of Science and Technology of China in 2010, the B.S degree from the Special Class for Gifted Young, University of Science and Technology of China in 2005. He has been awarded the "Excellent Youth" by National Natural Science Fund Committee, the Intel Young Scholar Award, the Excellent Doctoral Dissertation Award of China Computer Society and many other honors.

Dr. Shaoli Liu, the chief chip architect, received his Ph.D degree in Computer Sciences from Institute of Computing Technology in 2014 and his B.S. degree from Dept. of Mathematics, Nankai University in 2009. He then became an assistant professor in Institute of Computing Technologies and joined Cambricon Technologies Beijing in March 2016. He has been working on chip R&D for more than seven years, including first multi-core processor in China (Godson 3) as senior architect, video encoding/decoding IP development in Godson processors as principle architect, the world first deep learning processor as principle architect.

Dr. Qi Guo, the chief software R&D director, received the Ph.D. degree in Computer Sciences from Institute of Computing Technology in 2012 and the B.S. degree from Tongji University in 2007. He joined IBM Lab China as researcher from July 2012 to April 2014, then worked as postdoctoral researcher in Carnegie Mellon University from April 2014 to November 2015. After that, he joined Institute of Computing Technology as associate professor in December 2015 and joined Cambricon Technologies Beijing in March 2016.

Dr. Daofu Liu, the chief chip R&D director, received the Ph.D. degree from Institute of Computing Technology in 2015, the B.S degree from the Dept. of Computer, University of Science and Technology of China in 2010. He then joined Institute of Computing Technology as assistant professor in 2015 and joined Cambricon Technologies Beijing in March 2016. He has been working on chip R&D for more than seven years and taped out several chip successfully.

Dr. Zai Wang, the vice president of Cambricon Technologies, received the Ph.D. degree in 2011 and the B.S degree in 2006 both from University of Science and Technology of China. He worked as R&D engineer of kernel trading system in Commodity Exchange Zhengzhou from July 2011 to April 2015. He then joined Zhongyuan Bank as chief director of mobile banking, electronic banking, wechat banking etc. from May 2015 to February 2016 and joined Cambricon Technologies Beijing in March 2016.

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